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| We take our commitments seriously |
| Accuracy,
productivity and value to meet the changing needs of today and tomorrow.
With the most comprehensive, diversified offering of best-in-class products,
resulting in increasing yields and lower operating costs.
At Brain Power, doing
business means more than just closing a deal. It means developing long
term relationships and earning client trust. That is, listening to our
customers and responding quickly and precisely. Whether you are an existing
customer or new to our process, you will see immediately benefits from
choosing Brain Power to fulfill your PCB needs.
Excepting OEM PCB, i.e.
Telecommunication, PC Add-On Card, IT Application, Network Device, Multi
Layers FR-4 product, we have some outstanding products as follows:
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| 1. Carbon Built on PCB:
Apply for Thick Film Technology to make the PCB with
buried resistors or touch pad function. It is to reduce cost and increase
productivity without any function lessened. We have achieved the filed in
memory module PCB and touch pad.
It is easy to imaging a staggering number of resistors in the finished
board. We use an unusual technology to embed carbon resistors in our multi
layers boards instead of trying to populate all of resistors with external
components; it saves space and, hence, increase the speed of system and
short the production time consumed.
RAMBUS RIMM PCB: It is a new challenge to make 8 layers PCB with strict
impedance control as 28 Ohm 10%, and 4/4 mil trace. As a normal Multi
layers PCB, the registration among layers only allows 6 mil of tolerance.
This is a breakthrough in the PCB industry. With over a year of efforts,
we started the mass production starting 2000.
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2. Thin PCB: Less
than 16 mil thickness in 4 or 6 layers FR-4 production is another challenge
for our production capability. From raw material control, producing inner
conductor to lamination, we have to develop many tools to handle the interior
materials that are thin as paper. Those materials are mostly used in PC
CARDs and some MEMORY CARD, such as the MEMORY STICK, COMPACT FLASH etc.
We had produced over 200,000 pieces monthly for Flash Card or Flash Card
Reader device in past. The performance is resulting from our outstanding
board thickness control and thin PCB process.
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| 3. CSP // BGA PCB: Because
the chipset supports high frequency, many requires BGA package, i.e. AGP
card, DDR 400 etc. We understand that it is not only for surface flatness,
but also for filling VIA holes. Those kinds of PCB are increasing and we
expect the quantity will be over 10% of our production in coming years.
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| 4. Special Service:
In addition to devote in normal PCB process, our engineering team also provide
design support as requested by clients. With cooperation, we complete special
process products such as PCB for mobile phone battery with gold wire bonding.
The key point is that the surface of the plating needs to be very smooth
to reduce the friction between the battery with the mobile phone and the
charger. The number of rubbing might be over thousands of times within the
battery's shelf life. Therefore, we tailor made a laminate for this PCB,
the exterior is extra fine FR-4 cloth to substantially reduce the unevenness
of the wrap and weave. |
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2F. No. 386, Sunghe St., Taipei, Taiwan, R.O.C. 105
Tel: 886-2-2651-7866 Fax: 886-2-2651-2968/69
E-MAIL: sales@brain-power.net |
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